3D sensing illumination laser packages_Beijing Oaktec Technology Co.,LTD

3DS

3D sensing illumination laser packages

Sealed / hermetic packages

TO-56 (5.6mm diameter)

Also TO-9 (9mm), TO-38 (3.8mm)

Open / lead frame packages

Only several mm in dimension

May not be suitable for all Automobile environments

Bare die

Typically only for VCSEL

As small as several-100µm in dimension

点击数/观注度

2387

3D Sensing illumination

Lynx Chip Introduction

• Optical Module+-

• 3DS+-

• Passive Optical Device

• Test Equipment

• Active Optical Device

Lumentum

Edison

Viavi(RPC)

OAK

	Beijing Oaktec Technology Co.,LTD
	Add：2309-10, Digital A Building, No. 2 Zhongguancun South Street, Haidian District, Beijing, China
	+86 01051727688
	+86 010-51727688-8009
	lhyin@bjoaktec.com
	13810998648
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